Half-cut modules have become the mainstream of the market due to their high wattage and low cost per watt, and the way of reading thermal image inspection has changed accordingly. This article organizes the differences between full-chip and half-cut modules in thermal image inspection.

I. Major Differences in Thermal Imaging

Full-size (Full-square) module:

• 熱斑集中、面積大。
• 溫差常超過 10–20°C。
• 缺陷直覺、容易辨識。

Half-cut (Half-cut) module:

• 熱斑較小、較多較分散。
• 常出現在上半或下半模組。
• 溫差多落在 5–10°C。

Second, why does the half-cut module look less hot?

The half-cut module cuts the cell in half so that the current is diverted and the heat is proportional to the square of the current, so the heat is no longer concentrated, but it does not mean that the defects do not exist.

Impact on Inspection and Maintenance

• 全片模組：現場人員即可快速判斷。
• 半切模組：需考量電流分流效應，判讀門檻較高。

IV. CONCLUSION

The heat defect patterns of full-chip and half-cut modules are not the same in the shade condition. The complexity of the half-cut module manufacturing process is higher, and the structure of the module is smaller in size, making it easier for the diode to open and change the direction of the current flow, which affects power generation but helps to minimize the risk of fire caused by the hot spot of the module.